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Electromagnetic Modeling of Photolithography Aerial Image Formation Using the Octree Finite Element Method
aerial image finite element method photolithography electromagnetics octree simulation
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2014/12/8
Modern semiconductor manufacturing requires photolithographic printing of subillumination wavelength features in photoresist via electromagnetic energy scattered by complicated photomask designs. This...
Transmission-Line Metamaterial Design of an Embedded Line Source in a Ground Recess
Antenna radiation patterns metamaterials periodic structures transmission lines
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2014/12/8
A transmission-line metamaterial design of a material-embedded electric line source radiating inside a ground recess is investigated. The media embedding the recessed line source are designed such tha...
Impact of Manufacturing Flow on Yield Losses in Nanoscale Fabrics
Yield Analysis Nanotechnology NASIC Nanowire
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2014/12/8
Reliable and scalable manufacturing of nanofabrics entails significant challenges. Scalable nano-manufacturing approaches that employ the use of lithographic masks in conjunction with nanofabrication ...
Robust Signaling Techniques for Through Silicon Via Bundles
Through Silicon Via 3D Integration VLSI Signaling techniques Robustness
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2014/12/8
3D circuit integration is becoming increasingly important as one of the remaining techniques for staying on Moore’s law trajectory. 3D Integrated Circuits (ICs) can be realized using the Through Silic...
N3ASICS: Designing Nanofabrics with Fine-Grained CMOS Integration
NASIC N3ASIC nanowires nano-CMOS hybrid systems 3-D integration
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2014/12/8
Nanoscale-computing fabrics based on novel materials such as semiconductor nanowires, carbon nanotubes, graphene, etc. have been proposed in recent years. These fabrics employ unconventional manufactu...
Critical Area Driven Dummy Fill Insertion to Improve Manufacturing Yield
Dummy fill Manufacturability Critical Area CMP
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2014/12/8
Non-planar surface may cause incorrect transfer of patterns during lithography. In today’s IC manufacturing, chemical mechanical polishing (CMP) is used for topographical planarization. Since polish r...
A New Class of Improved Bandwidth Planar Ultrawideband Modular Antenna (PUMA) Arrays Scalable to mm-Waves
Antenna arrays mm-wave array Dipole Planar arrays Ultrawideband
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2014/12/8
A new class of Planar Ultrawideband Modular Antenna (PUMA) arrays, termed PUMAv3, is introduced to offer improved performance and further meet demand needs for multifunctional systems. PUMAv3 extends ...
Impedance Measurement of Small Antennas Over a Ground Plane Without Direct Cable Attachment
Antenna impedance measurement small antennas
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2014/12/8
An indirect impedance measurement approach that does not require direct cable attachment or large space using a two-port network is presented. Using a straight wire monopole as an interrogating antenn...
Design and Evaluation of an L-Band Current-Mode Class-D Power Amplifier Integrated Circuit
power amplifier mixer integrated circuit model efficiency
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2014/12/8
Power amplifiers (PAs) convert energy from DC to high frequencies in all radio and microwave transmitter systems be they wireless base stations, handsets, radars, heaters, and so on. PAs are the domin...
ZnO/ZnFe2O4复合纳米粒子的制备及其特性研究
ZnO ZnFe2O4 纳米复合结构 光催化特性
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2016/8/11
利用水热法制备了ZnO/ZnFe2O4纳米复合粒子。用扫描电子显微镜(SEM)、X射线衍射(XRD)、光致发光光谱(PL)对退火前后的ZnO/ZnFe2O4纳米粒子进行表征。研究结果表明, 退火后的ZnO/ZnFe2O4纳米复合粒子表现出更好的形貌和晶体质量, 主要由六角纤锌矿结构的ZnO和立方结构的ZnFe2O4构成。PL光谱显示, 退火后ZnO近带边的发光强度明显降低, 这是由于ZnO/ZnF...
On Detection, Analysis and Characterization of Transient and Parametric Failures in Nano-scale CMOS VLSI
Automatic Test Pattern Generation Crosstalk Design-for-Testability Integrated Circuit Intermittent Failure Soft Error
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2014/11/7
As we move deep into nanometer regime of CMOS VLSI (45nm node and below), the device noise margin gets sharply eroded because of continuous lowering of device threshold voltage together with ever incr...
Band Structure Calculations of Strained Semiconductors Using Empirical Pseudopotential Theory
electronic band structure empirical pseudopotential method semiconductor silicon nanowire strain supercell
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2014/11/7
Electronic band structure of various crystal orientations of relaxed and strained bulk, 1D and 2D confined semiconductors are investigated using nonlocal empirical pseudopotential method with spin-orb...
MIM结构中腔的物理性质对SPP传播的分析
非线性光学 MIM 波导 耦合模式 表面等离子激元
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2016/8/5
为了研究MIM 结构中腔的物理性质对SPP 传播的影响,采用了对波导模式、谐振和反射系数以及相位分析的理论方法,讨论了腔长和厚度对SPP 传播的相关参数的影响,仿真了MIM 波导中电动势、腔长和反射系数等参数在结构中作用.结果表明,SPP 传播产生的电动势能达到相对较大的1V,激发产生的能场会有放大的作用;腔的有效功率变化与腔长变化一致,不同的腔厚度中腔长对SPP 传播的结果趋势相同;近场中传播系...
本文采用混合集成技术,实现了75~115GHz的W波段六倍频功率合成信号源.其Ku波段输入信号经有源二倍频、功分及放大后,输出两路各约24dBm的Ka波段信号,以驱动75~115GHz三倍频器,变阻二极管基于南京电子器件研究所(NEDI)的GaAs工艺线设计实现,三倍频信号经功率合成后输出.考虑到倍频二极管各种寄生参数的影响,本文采用去嵌入阻抗计算方法,提取二极管的输入阻抗及三次谐波输出阻抗,综合...