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Non-Equilibrium Molecular Dynamics Simulation of Electromigration in Aluminum-Based Metallic Interconnects
Electromigration Diffusion Non-equilibrium molecular dynamics
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2009/10/9
The effect of alloying elements in aluminum on diffusion behavior was investigated using non-equilibrium molecular dynamics (NEMD) under the effect of electromigration wind force. The electromigration...
Diluting and Annealing Effects on Electromigration and Morphology of Chemical Vapor Deposited Copper Films
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2007/7/28
期刊信息
篇名
Diluting and Annealing Effects on Electromigration and Morphology of Chemical Vapor Deposited Copper Films
语种
英文
撰写或编译
撰写
作者
Song Wu,Xiao-Feng Li,Xin Liu,Qi Wang（王琦*）
第一作者单位
浙江大学化学系
刊物名称
Vacuu...
Comparative Study of Statistical Distributions in Electromigration-Induced Failures of Al/Cu Thin-Film Interconnects
Statistical Distributions Electromigration-Induced Failures Al/Cu Thin-Film Interconnects
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2010/12/15
In electromigration failure studies, it is in general assumed that electromigration-induced failures may be adequately modelled by a log-normal distribution. Further to this, it has been argued that a...