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Plug-in Hybrid Electric Vehicles (PHEV) are new generation Hybrid Electric Vehicles (HEV) with larger battery capacity compared to Hybrid Electric Vehicles. They can store electrical energy from a dom...
DDS+PLL Hybrid结构兼顾DDS和PLL的优势,但也兼具DDS和PLL的缺点:宽带信号性能较差;零相位误差跟踪的实现难度大;环路稳定性差;较长的捕获时间;调频斜率受限等。提出了在传统的DDS+PLL Hybrid结构中增加频率扫描电路的方法,能够有效降低环路设计难度,提高了捕获速度。扫频电路使大带宽、短脉冲的调频信号的产生成为可能。同时提出了预失真相位补偿的方法,极大地提升了信号的脉压性...
In this study, a new soft-switching hybrid filter based on a neuro-fuzzy network for impulsive noisy environments is proposed. The hybrid filter was built by combining an adaptive finite impulse respo...
Parallel Prefix addition is a technique for improving the speed of binary addition. Due to continuing integrating intensity and the growing needs of portable devices, low-power and highperformance ...
Surface-plasmon-polariton (SPP) waveguides made of materials available in nature have, in general, been found to suffer from very high absorption loss when light confinement is beyond diffraction limi...
期刊信息 篇名 Electron dose calculation using multiple-scattering theory: a hybrid electron pencil-beam model 语种 中文 撰写或编译 撰写 作者 Luo Zhengming,David Jette,and Susan Walker 第一作者单位 刊物名称 Med. Phys 页面 出版日期 1998年...
The organo-inorganic hybrid material, consisting of Poly(3,4-Ethylene Dioxythiophene) (PEDOT) doped with phosphomolybdate cluster anions [PMo12O40]3− , has been synthesized by direct in situ oxi...
Poly(3,4-ethylene dioxythiophene) (PEDOT) has been inserted between the layers of crystalline V2O5 via the in situ polymerization of EDOT within the framework of the oxyde. The insertion increases the...
A novel planar quasi-monolithic (QM)hybrid integration technology for microwave and millimeter-wave application is presented. Microwave transistor chips are embedded in high-resistivity silicon substr...
This paper reports first on general considerations on electrochromic materials in order to present, afterwards, electrochromic films having a hybrid PAA (polyacrylic acid)-WO3 structure. The films are...
This paper deals with the placement of heat dissipating components in hybrid circuits. An optimum placement is found when the extreme temperatures on the substrate are minimized. Whereas classical tec...
Reliability Prediction of Thick Film Hybrid Integrated Circuits     Reliability  Prediction methods  Thick film  ICs       font style='font-size:12px;'> 2010/12/16
When using the well known handbooks for reliability predicting (MIL, CNET) some problems occur in quality assessment of components which are not produced according to the requirements of the US milita...
One of the more important fields of the microelectronics industry is the manufacturing of hybrid integrated circuits.An important part of the manufacturing process is concerned with the trimming of th...
In this paper are presented design and performance data on microwave Y–circulators and Gunn oscillators produced in thick-film technology. Y–circulators have been designed for central frequencies of 3...
The present paper is devoted to the technological problems connected with the construction, the choice of pastes and substrates, the screening process and the laser or abrasive trimming involved in th...

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