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Preparation of fluorinated epoxy-phthalonitrile resins with excellent thermal stability and low dielectric constant
curing behavior fluorinated epoxy-phthalonitrile resins low dielectric constant thermal stability
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2023/11/16
Fluoropolymers find applications in heat-resistant cables, chemical-resistant linings, electronic components, cladding materials, and weather-resistant films. Therefore, it is imperative to improve th...
Biorenewable rosin derived benzocyclobutene resin: a thermosetting material with good hydrophobicity and low dielectric constant
CROSS-LINKING POLYMER TEMPERATURE NANOINDENTATION
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2024/3/5
Development of bio-based polymers has been promoted by the growing concerns about the long-term sustainability and negative environmental footprint of petroleum-based polymer materials. A new monomer ...
超低介电常数介孔氧化硅薄膜的制备及其表征（Synthesis of Mesoporous Thin Silica Films with Ultra Low Dielectric Constant）
TEOS蒸汽 甲基化 介孔氧化硅薄膜 超低介电常数
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2010/8/24
研究了以正硅酸乙酯(TEOS)和甲基三乙氧基硅烷(MeSi(OEt)3)为混合硅源，十六烷基三甲基溴化铵(CTAB)为模板剂，采取旋涂技术，在硅晶片表面制备出二氧化硅透明薄膜，再经过正硅酸乙酯(TEOS)蒸汽孔壁强化后采用线性升温焙烧法脱除薄膜孔道内的模板剂，制备出具有超低介电性能的氧化硅薄膜。使用FTIR、XRD和SEM对样品进行了结构表征，并采用阻抗分析仪测量了薄膜的介电常数(k)，纳米硬度计...